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Abstract: Impact of temporary bonding conditions and temporary adhesive properties on mechanical stresses in multichip thinning is evaluated for high-yield multichip-to-wafer (MC2W) heterogeneous 3D ...

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Abstract: Microchannel cooling method for stacked 3D-IC has process and cost issues. The proposed method, the thermal fluid chamber, exploits the gap between the upper and lower stacks. The method ...