TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...
200 V, 10 mΩ EPC2307 GaN FET in a thermally enhanced QFN in a tiny 3 mm x 5 mm footprint EPC introduces 200 V, 10 mΩ EPC2307 GaN FET optimized for DC-DC conversion, AC/DC SMPS and chargers, solar ...
Using a new high-performance elastomer, the SM-QFN-9019 QFN socket is designed for 13 x 19-mm mixed-pitch QFN packages and operates at bandwidths to 40 GHz with less than 1dB of insertion loss. The ...
Design engineers using 0.5-mm pitch 48-position MLF/QFN packaged ICs will be interested in the PA-MLF48A-P-Z-02 adapter, which provides high-performance quick prototyping. It comes with a clam-shell ...
QFNs can be pretty annoying. It’s been said over and over that you don’t want to leave the solder paste opening wide open for a QFN center pad. 50 – 75% paste coverage will get you bets results. QFNs ...
MicroLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent more than a ...
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