-Made possible through sintering paste for via bonding technology and ultra-high-thickness PCB manufacturing technology - OKI Circuit Technology (OTC; President: Masaya Suzuki; Head office: Tsuruoka ...

What methods can be applied to verify PCB functionality and safety? Which are suitable for mass production and for prototypes? What parameters are checked in each test? How to check a PCB without ...

When a tier-one automotive supplier, a long-time customer of Pensar Otra Vez, needed a new printed-circuit board (PCB) handler, project manager Mike Edwards automatically went back to the drawing ...

DRAMMEN, Norway, May 8, 2026 /PRNewswire/ -- Board-level and semiconductor test data are often analyzed separately, limiting correlation across the product lifecycle. Linking PCB assembly (PCBA) test ...

From test coupons and burn-in chambers to ICT and flying probes, effective factory testing is essential for delivering reliable products and maintaining process control. Factory testing comes in ...

As the core technology used in modern electronics manufacturing, surface-mount technology (SMT) assembly density is increasing, the number of pins is increasing, and the pitch is decreasing. In ...

Saelig Company, Inc. has introduced the ABI BoardMaster-RM Universal PCB Test Solution – a unique, versatile, self-contained, and easy-to-use PCB test system, now housed in a convenient 19” rack case.

Conducting product testing on printed circuit boards (PCBs) has the potential to become costly. Because of this, it’s easy for businesses to view PCB assembly testing as an expense without much value.

Designing circuit boards for high speed applications requires special considerations. This you already know, but what exactly do you need to do differently from common board layout? Building on where ...

If the folks at ECM PCB Stator Technology have their say, applications for printed circuit board (PCB) stator motors will replace the bulky copper windings associated with electric motors. The ...

Surface-mount technology (SMT) is evolving far beyond its roots as a way of assembling packaged chips onto printed circuit boards without through-holes. It is now moving inside packages that will ...