Global Unichip Corp. (GUC), theAdvanced ASIC Leader, today announced the launch of its next-generation 2.5D/3D Advanced Package Technology (APT) platform, developed to accelerate design cycles and ...
Collaboration combines GUC's ASIC design leadership with Lightmatter's industry-leading 3D CPO platform to redefine AI infrastructure scalability MOUNTAIN VIEW, Calif. & HSINCHU, Taiwan, January 27, ...
HSINCHU, Taiwan, May 26, 2026 (GLOBE NEWSWIRE) -- Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced Jotunn8, a next-generation data center AI inference processor developed by VSORA ...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced a strategic technical collaboration with Wiwynn, an innovative cloud IT infrastructure provider for data centers. This ...
GUC engineers are using Ansys HFSS 3D Layout's advanced simulation workflow to speed advanced integrated circuit (Advanced-IC) design The workflow helps GUC rapidly incorporate its die-to-die solution ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Global Unichip Corp. (GUC) successfully delivered an advanced HPC design and a CPU design using ...
Cadence’s Innovus Implementation System mixed-placer automation delivers more than 10% wirelength reduction and 5% better switching power GUC reduces floorplan design time from weeks to days, ...
SAN JOSE, Calif.--(BUSINESS WIRE)--Global Unichip Corporation (GUC), the advanced ASIC leader, and Omni Design Technologies, a leading provider of high-performance, low-power mixed-signal Intellectual ...
Advanced ASIC leader Global Unichip Corp (GUC) has developed GLink, a high-bandwidth, low-latency, and power-efficient die-to-die (D2D) interface. GLink offers the industry’s highest optimized ...