TIER IV, the pioneering force behind open-source software for autonomous driving, has officially joined the Automotive Chiplet Program (ACP) overseen by imec, a world-leading research and innovation ...

HyperLight delivers high-performance integrated photonics solutions based on thin-film lithium niobate technology. The company combines the electro-optic advantages of TFLN with scalable manufacturing ...

For decades, monolithic system-on-chip (“SoC”) designs defined the semiconductor landscape. Introduced in the 1970s[1] and refined over several generations, SoCs allowed designers to integrate ...

What’s Arm up to in design and development of chiplets, the highly integrated large-scale silicon solutions? The IP giant is gradually unveiling its design blueprint for one of the most exciting ...

United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) ("UMC"), and Wavetek Microelectronics Corporation ("Wavetek"), a wholly owned subsidiary of UMC, today announced a strategic manufacturing ...

AI data centers are starting to replace copper with co-packaged optics in an effort to reduce energy consumed per bit and ...

The awards spotlight application acceleration, packaging, die-to-die interfaces, and other key technical areas. Chiplet Summit, the premier global event focused on chiplet-based design and integration ...

UCIe 3.0 springs open the door to higher speeds, enhanced link reliability, and smarter system coordination for increasingly complex chiplet packaging needs.

Eliyan Corp., a startup developing technology for building chiplet-based processors, today announced that it has closed a $40 million funding round. The Series A round was led by Tracker Capital.

Chiplet Summit, the biggest chiplet show ever, announces its pre-conference day schedule. It will occur on Tuesday, February 17, at the Santa Clara Convention Center, ahead of the main event taking ...