BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...
Designed for cooling BGA components in low airflow velocity conditions, the EX2 heat sink is 9 mm high, suiting it for use inside low-profile enclosures. Its case-to-ambient thermal resistance is 1.8 ...
The SG-BGA-8019 socket for 1.0-mm pitch BGAs is designed for a 35-mm package size and operates at bandwidth up to 10 GHz with less than 1dB of insertion loss. The socket dissipate 16 watts. Its swivel ...
The Configurable High Insertion Count (CHIC) Socket lets users of programming and automatic test equipment accommodate any BGA package. It improves electrical contact reliability compared to ...
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