The introduction of full 3D-ICs will require a simultaneous analysis of various physical effects under different workloads, a step-function change that will add complexity at every step of the design ...

Chiplet PHY simulator addresses the effects of forward clocking with single-ended signaling and higher bit error rate on die-to-die interconnect performance of ...

Physics AI engineering simulation tools reached production at General Motors this week, cutting a two-week aerodynamics cycle ...

The semiconductor industry is at a pivotal moment as the limits of Moore’s Law motivate a transition to three-dimensional integrated circuit (3D IC) technology. By vertically integrating multiple ...